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L2293Q
Push-pull four channel driver with diodes
Features

600 mA output current capability per channel 1.2 A peak output current (non repetitive) per channel Enable facility Overtemperature protection Logical "0" input voltage up to 1.5 V (high noise immunity) Internal clamp diodes
VFQFPN 5 mm x 5 mm 32L
Description
The device is a monolithic integrated high voltage, high current four channel driver designed to accept standard DTL or TTL logic levels and drive inductive loads (such as relays solenoides, DC and stepping motors) and switching power transistors. Figure 1. Block diagram
To simplify use as two bridges each pair of channels is equipped with an enable input. A separate supply input is provided for the logic, allowing operation at a lower voltage and internal clamp diodes are included. This device is suitable for use in switching applications at frequencies up to 5 kHz. The L2293Q is assembled in a VFQFPN-32L 5x5 package which has exposed pad available for heatsinking.
July 2008
Rev 1
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Contents
L2293Q
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 1.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 3 4 5 6
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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L2293Q
Electrical data
1
1.1
Electrical data
Absolute maximum ratings
Table 1.
Symbol VS VSS Vi Ven Io Ptot TJ TSTG Supply voltage Logic supply voltage Input voltage Enable voltage Peak output current (100 s non repetitive) Total power dissipation at Tpins = 90 C Junction temperature Storage temperature
Absolute maximum ratings
Parameter Value 36 36 7 7 1.2 4 150 - 40 to 150 Unit V V V V A W C C
1.2
Recommended conditions
Table 2.
Symbol VS VSS TJ Supply voltage Logic supply voltage Junction temperature
Recommended conditions
Value Parameter Min VSS 2.8
(1)
Unit Typ Max 36 36 125 V V C
-20 (1)
1. See Figure 2
Figure 2.
Typical minimum logic supply voltage vs junction temperature
VSS_min [V]
2.8
2.7
-20
-10
0
Tj [C]
1.3
Thermal data
Table 3.
Symbol Rth(JA)
Thermal data
Parameter Thermal resistance junction-ambient max (1). Value 22 Unit C/W
1. Mounted on a double-layer FR4 PCB with a dissipating copper surface of 0.5 cm2 on the top side plus 6 cm2 ground layer connected through 18 via holes (9 below the IC).
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Pin connection
L2293Q
2
Pin connection
Figure 2. Pin connection (top view)
Note:
NC(1) These NC pins are connected to the exposed PAD. The exposed PAD must be connected to GND pins. NC(2) These NC pins can be connected to GND pins and exposed PAD. Figure 3. Recommended PCB layout for Rth(JA) optimization
L2293Q
(connected to GND)
TOP LAYER
BOTTOM LAYER (connected to GND)
GND pins VIA holes
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L2293Q
Pin connection
Table 4.
N
Pin description
Pin NC NC GND OUTPUT2 INPUT2 VS O I Type Not connected Pins connected to the exposed PAD Ground Output 2 Input 2 Supply voltage for the power output stages. A non-inductive 100 nF capacitor must be connected between these pins and ground. I I O O I Enable 2 input, the LOW state disables the Output 3 and Output 4. Input 3 Output 3 Output 4 Input 4 Supply voltage for the logic blocks. A 100 nF capacitor must be connected between this pin and ground. I I O Enable 1 input, the LOW state disables the Output 1 and Output 2. Input 1 Output 1 Function
1, 18, 19, 20, 21, 22, 23 2, 3, 4, 5, 6, 7, 8, 9, 17, 24, 28, 32 10 11 12, 13
14 15 16 25 26 27 29 30 31
ENABLE2 INPUT3 OUTPUT3 OUTPUT4 INPUT4 VSS ENABLE1 INPUT1 OUTPUT1
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Electrical characteristics
L2293Q
3
Table 5.
Symbol
Electrical characteristics
Electrical characteristics (for each channel, VS = 24 V, VSS = 5 V, TA = 25 C, unless otherwise specified)
Pin Parameter Test condition Vi = L; IO = 0; Ven = H IS 12,13 Total quiescent supply current Vi = H; IO = 0; Ven = H Ven = L 27 ISS Total quiescent logic supply current 11, 15, 26, 30 11, 15, 26, 30 11, 15, 26, 30 11, 15, 26, 30 14, 29 14, 29 14, 29 14, 29 10, 16, 25, 31 10, 16, 25, 31 Vi = L; IO = 0; Ven = H Vi = H; IO = 0; Ven = H Ven = L VIL
VIH
Min
Typ 2 16
Max 6 24 4
Unit mA mA mA mA mA mA V V V A A V V V A A V V V
44 16 16 - 0.3
60 22 24 1.5 VSS 7 - 10
Input low voltage VSS 7 V VSS > 7 V Low voltage input current High voltage input current Enable low voltage Enable high voltage Low voltage enable current High voltage enable current Source output saturation voltage Sink output saturation voltage Clamp diode forward voltage VSS 7 V VSS > 7 V Ven L = 1.5 V 2.3 V Ven H VSS - 0.6 V IO = - 0.6 A IO = + 0.6 A IO = 600 nA VIL = 1.5 V 2.3 V VIH VSS - 0.6 V
2.3 2.3
Input high voltage
IIL IIH Ven L Ven H Ien L Ien H VCE(sat)H VCE(sat)L VF
30 - 0.3 2.3 2.3
100 1.5
VSS
7 - 30 - 100 10 1.4 1.2 1.3 1.8 1.8
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L2293Q
Electrical characteristics
Table 6.
Symbol
t
AC operation (Vs = 24 V, Vss = 5 V, TA = 25 C, unless otherwise specified)
Parameter Rise time (1) Fall time
(1) (1)
Test condition 0.1 to 0.9 VO 0.9 to 0.1 VO 0.5 Vi to 0.5 VO 0.5 Vi to 0.5 VO
Min
Typ 250 250 750 200
Max
Unit ns ns ns ns
r
tf ton toff
Turn-on delay
Turn-off delay (1)
1. See Figure 4
Figure 4.
Switching times
Table 7.
Truth table (one channel)
Input H L H L Enable(1) H H L L Output H L Z (2) Z (2)
1. Relative to the considered channel 2. Z = High output impedance
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Package mechanical data
L2293Q
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Table 8. VFQFPN 5x5x1.0 32L pitch 0.50
Databook (mm) Dim. Min A b b1 D D2 D3 E E2 E3 e L ddd 0.30 0.80 0.18 0.165 4.85 3.00 1.10 4.85 4.20 0.60 Typ 0.85 0.25 0.175 5.00 3.10 1.20 5.00 4.30 0.70 0.50 0.40 0.50 0.08 Max 0.95 0.30 0.185 5.15 3.20 1.30 5.15 4.40 0.80
Note:
1 2
VFQFPN stands for thermally enhanced very thin profile fine pitch Quad Flat Package No lead. Very thin profile: 0.80 < A 1.00 mm. Details of terminal 1 are optional but must be located on the top surface of the package by using either a mold or marked features.
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L2293Q Figure 5. Package dimensions
Package mechanical data
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Order codes
L2293Q
5
Order codes
Table 9. Order code
Order code L2293Q Package VFQFPN 5x5x1.0 32L Packaging Tube
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L2293Q
Revision history
6
Revision history
Table 10.
Date 10-Jul-2008
Document revision history
Revision 1 First release Changes
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L2293Q
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